Predictika · Semiconductor assembly equipment: die bonder configuration with options

An AI sales agent's die bonder configuration, checked before it goes out

An AI sales agent prepares a configuration for a high-accuracy die bonder: the die and wafer to be handled, the bond force, the placement accuracy and throughput the customer needs, and the optional upgrades. Before it goes out, the agent sends it to Predictika, which checks it against a declarative model of the published specification and options and returns a verdict, every reason and the figures it computed.

Scope: Datacon 8800 CHAMEO advanced configurations: die size by orientation, die thickness, wafer size, strip length, bond force, placement accuracy, throughput and the optional upgrades. See everything this validator covers

This validator models configurations of one machine, the Besi Datacon 8800 CHAMEO advanced, from the specification table and options list on its public product page, not just the scenarios shown below.

  • Die and wafer — die size 0.3 to 30 mm face down (40 mm with the large-die option) and 2.5 to 25 mm face up, die thickness 50 µm to 3 mm, wafers of 8 to 12 inches, strips, boats and panels up to 340 mm.
  • Bond force, accuracy and speed — bond force 2 to 50 N (0.5 to 10 N with the low-force option), local placement accuracy ±3 µm at 3 sigma (±2 µm with the high-accuracy option), up to 7,000 units per hour. The accuracy stated on the quote is compared with the accuracy the selected configuration gives.
  • Options — the tape feeder (tape 8 to 32 mm wide), the fluxer and the ISO 5 clean room option must be selected when the order needs them.

Any configuration of this machine is in scope — not only the scenarios pictured here. Not covered: prices (no public price list was found, so this validator produces no price build-up or line-item quote), other Datacon and Besi models, global placement accuracy, vision system, footprint and facilities, accessories, service and regional terms. The product page does not say how the options combine, so no rule about combining them is modeled.

The AI sales agentBuilds the die bonder configuration from the conversation and says it is ready.
Predictika validatorChecks every rule at once and returns the verdict, each finding, and the computed figures.

7 scenarios in 3 groups · each group runs from the agent’s first attempt to the outcome · click one to switch

What the agent proposes

The AI sales agent says

Illustrative agent statement. The validator receives the structured request below.

Proposing agent: AI sales agent (scripted)

Before sending, the agent must call Recorded run

Predictika validator


      

        
        
        
      

      
Waiting for the call.

      
    

  

  
  

    
Where rules-based CPQ gets it wrong
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Our assessment of what a typical rules-based CPQ (product rules, price rules and validation rules, as in Salesforce CPQ) does with the same cases. It is a judgment about effort and reliability, not a claim that nothing can be built.

    
What the validator caughtTypical rules-based CPQPredictika
Die size limits that depend on orientation and an optionOnly with care
Face-down and face-up dies have different size ranges, and the face-down upper limit moves from 30 mm to 40 mm with an option, so the limit depends on two choices at once.		Orientation, die size and options arrive together; the range is computed from all three on every call.
Options the order needs but did not selectOnly with workarounds
A need such as fluxing, tape feed or a clean room class is a separate fact from the option that serves it; a product rule can link them, but each pair needs its own rule.		What the process needs and what was selected are in one request; every mismatch is returned together.
Ranges that change with an optionOnly with care
Bond force and placement accuracy have a standard range and a different range with an option, so a fixed range check is wrong whenever the option is chosen.		The range in force is computed from the selected options, then the needed value is checked against it.
Stated accuracy that must match the configurationOnly with care
A stated figure is a free-entry field; a rule can compare it with the computed figure, but someone has to write and maintain that comparison.		The stated accuracy travels with the configuration and is compared with the computed accuracy on every call.
Every problem returned in one answerOnly with workarounds
Rules tend to fire as the order is saved or a step is completed, so a rep often fixes one error and meets the next.		All findings come back together, whatever order the choices arrived in.

  

  

    
What this validator catches: findings from its test cases
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Every rule is checked on every call, in any order the choices arrive; one problem never hides another. Blocking findings stop the quote; approval findings need a person to sign off; everything else is computed.

    
1The die size is 0.299 mm; face-down placement takes 0.3 mm to 30 mm, or up to 40 mm with the 40 mm die option.
2The die size is 30.001 mm; face-down placement takes 0.3 mm to 30 mm, or up to 40 mm with the 40 mm die option.
3The die size is 40.001 mm; face-down placement takes 0.3 mm to 30 mm, or up to 40 mm with the 40 mm die option.
4The die size is 2.499 mm; face-up placement takes 2.5 mm to 25 mm.
5The die size is 25.001 mm; face-up placement takes 2.5 mm to 25 mm.
6The die size is 30 mm; face-up placement takes 2.5 mm to 25 mm.
7The die thickness is 49 microns; the supported range is 50 microns to 3,000 microns.
8The die thickness is 3,001 microns; the supported range is 50 microns to 3,000 microns.
9The wafer size is 6 inches; the supported range is 8 to 12 inches.
10The wafer size is 13 inches; the supported range is 8 to 12 inches.
11The strip, boat or panel is 341 mm long; the maximum is 340 mm.
12The bond force needed is 1.9 N; the standard range is 2 N to 50 N, or 0.5 N to 10 N with the low-force option.
13The bond force needed is 50.1 N; the standard range is 2 N to 50 N, or 0.5 N to 10 N with the low-force option.
14The bond force needed is 0.4 N; the standard range is 2 N to 50 N, or 0.5 N to 10 N with the low-force option.
15The bond force needed is 0.5 N; the standard range is 2 N to 50 N, or 0.5 N to 10 N with the low-force option.
16The local placement accuracy needed is 2 microns at 3 sigma; the selected configuration gives 3 microns (3 microns standard, 2 microns with the high-accuracy option).
17The local placement accuracy needed is 1 micron at 3 sigma; the selected configuration gives 2 microns (3 microns standard, 2 microns with the high-accuracy option).
18The throughput needed is 7,001 units per hour; the maximum is 7,000 units per hour.
19The order feeds from tape but the tape feeder option is not selected.
20The tape is 7 mm wide; the tape feeder option takes 8 mm to 32 mm.
21The tape is 33 mm wide; the tape feeder option takes 8 mm to 32 mm.
22The process needs fluxing but the fluxer option is not selected.
23The customer needs ISO 5 clean room class but the ISO 5 option is not selected.
24The quote states a local placement accuracy of 2 microns; the selected configuration gives 3 microns.
25The quote states a local placement accuracy of 3 microns; the selected configuration gives 2 microns.
26The die size is 26 mm; face-up placement takes 2.5 mm to 25 mm.
27The die thickness is 20 microns; the supported range is 50 microns to 3,000 microns.
28The wafer size is 14 inches; the supported range is 8 to 12 inches.
29The strip, boat or panel is 400 mm long; the maximum is 340 mm.
30The bond force needed is 0.1 N; the standard range is 2 N to 50 N, or 0.5 N to 10 N with the low-force option.
31The local placement accuracy needed is 1 micron at 3 sigma; the selected configuration gives 3 microns (3 microns standard, 2 microns with the high-accuracy option).
32The throughput needed is 9,000 units per hour; the maximum is 7,000 units per hour.
33The tape is 40 mm wide; the tape feeder option takes 8 mm to 32 mm.
34The quote states a local placement accuracy of 9 microns; the selected configuration gives 3 microns.

  

  

    
Scenarios and results
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The recorded result of the validator for each scenario on this page: the request the AI agent sent, the verdict, and every finding, in the order they appear above.

    
1. Large die and options: A 35 mm face-down die with fluxing, tape feed, a clean room and 2 micron accuracy, and no options selected

    
The agent's request. Please quote a Datacon 8800 CHAMEO advanced for face-down placement of 35 mm dies, 100 microns thick, from 12-inch wafers and strips up to 300 mm long, with a bond force of 5 N, a local placement accuracy of 2 microns at 3 sigma and 6,500 units per hour, fed from 24 mm tape, with fluxing, for an ISO 5 clean room, with no options. The quote states a local placement accuracy of 2 microns. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Die size outside the face-down range. The die size is 35 mm; face-down placement takes 0.3 mm to 30 mm, or up to 40 mm with the 40 mm die option.
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  • Placement accuracy not met. The local placement accuracy needed is 2 microns at 3 sigma; the selected configuration gives 3 microns (3 microns standard, 2 microns with the high-accuracy option).
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  • Tape feeder option not selected. The order feeds from tape but the tape feeder option is not selected.
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  • Fluxer option not selected. The process needs fluxing but the fluxer option is not selected.
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  • Clean room option not selected. The customer needs ISO 5 clean room class but the ISO 5 option is not selected.
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  • Stated accuracy does not match. The quote states a local placement accuracy of 2 microns; the selected configuration gives 3 microns.
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2. Large die and options: The agent resubmits after fixing the errors

    
The agent's request. Please quote a Datacon 8800 CHAMEO advanced for face-down placement of 35 mm dies, 100 microns thick, from 12-inch wafers and strips up to 300 mm long, with a bond force of 5 N, a local placement accuracy of 2 microns at 3 sigma and 6,500 units per hour, fed from 24 mm tape, with fluxing, for an ISO 5 clean room, with the 40 mm die option, the low-force option, the high-accuracy option, the tape feeder, the fluxer and the ISO 5 clean room option. The quote states a local placement accuracy of 2 microns. It is ready to send.

    
Verdict: Allowed.

    
    
      
  • Configuration summary. Local placement accuracy of 2 microns at 3 sigma.
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3. Face-up die, thin die and low force: A 27 mm face-up die, 40 micron thick, on a 380 mm strip at 1.5 N

    
The agent's request. Please quote a Datacon 8800 CHAMEO advanced for face-up placement of 27 mm dies, 40 microns thick, from 10-inch wafers and strips up to 380 mm long, with a bond force of 1.5 N, a local placement accuracy of 3 microns at 3 sigma and 5,000 units per hour, with no options. The quote states a local placement accuracy of 3 microns. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Die size outside the face-up range. The die size is 27 mm; face-up placement takes 2.5 mm to 25 mm.
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  • Die thickness outside the range. The die thickness is 40 microns; the supported range is 50 microns to 3,000 microns.
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  • Strip, boat or panel too long. The strip, boat or panel is 380 mm long; the maximum is 340 mm.
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  • Bond force outside the range. The bond force needed is 1.5 N; the standard range is 2 N to 50 N, or 0.5 N to 10 N with the low-force option.
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4. Face-up die, thin die and low force: The agent resubmits after fixing the errors

    
The agent's request. Please quote a Datacon 8800 CHAMEO advanced for face-up placement of 24 mm dies, 60 microns thick, from 10-inch wafers and strips up to 320 mm long, with a bond force of 1.5 N, a local placement accuracy of 3 microns at 3 sigma and 5,000 units per hour, with no options. The quote states a local placement accuracy of 3 microns. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Bond force outside the range. The bond force needed is 1.5 N; the standard range is 2 N to 50 N, or 0.5 N to 10 N with the low-force option.
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5. Face-up die, thin die and low force: The agent resubmits after fixing the errors

    
The agent's request. Please quote a Datacon 8800 CHAMEO advanced for face-up placement of 24 mm dies, 60 microns thick, from 10-inch wafers and strips up to 320 mm long, with a bond force of 1.5 N, a local placement accuracy of 3 microns at 3 sigma and 5,000 units per hour, with the low-force option. The quote states a local placement accuracy of 3 microns. It is ready to send.

    
Verdict: Allowed.

    
    
      
  • Configuration summary. Local placement accuracy of 3 microns at 3 sigma.
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6. Throughput, accuracy and options: A face-down order at 8,000 units per hour with 2 micron accuracy, 1 N force and no options selected

    
The agent's request. Please quote a Datacon 8800 CHAMEO advanced for face-down placement of 20 mm dies, 150 microns thick, from 12-inch wafers, with a bond force of 1 N, a local placement accuracy of 2 microns at 3 sigma and 8,000 units per hour, fed from 12 mm tape, with fluxing, for an ISO 5 clean room, with no options. The quote states a local placement accuracy of 2 microns. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Bond force outside the range. The bond force needed is 1 N; the standard range is 2 N to 50 N, or 0.5 N to 10 N with the low-force option.
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  • Placement accuracy not met. The local placement accuracy needed is 2 microns at 3 sigma; the selected configuration gives 3 microns (3 microns standard, 2 microns with the high-accuracy option).
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  • Throughput above the maximum. The throughput needed is 8,000 units per hour; the maximum is 7,000 units per hour.
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  • Tape feeder option not selected. The order feeds from tape but the tape feeder option is not selected.
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  • Fluxer option not selected. The process needs fluxing but the fluxer option is not selected.
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  • Clean room option not selected. The customer needs ISO 5 clean room class but the ISO 5 option is not selected.
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  • Stated accuracy does not match. The quote states a local placement accuracy of 2 microns; the selected configuration gives 3 microns.
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7. Throughput, accuracy and options: The agent resubmits after fixing the errors

    
The agent's request. Please quote a Datacon 8800 CHAMEO advanced for face-down placement of 20 mm dies, 150 microns thick, from 12-inch wafers, with a bond force of 1 N, a local placement accuracy of 2 microns at 3 sigma and 7,000 units per hour, fed from 12 mm tape, with fluxing, for an ISO 5 clean room, with the low-force option, the high-accuracy option, the tape feeder, the fluxer and the ISO 5 clean room option. The quote states a local placement accuracy of 2 microns. It is ready to send.

    
Verdict: Allowed.

    
    
      
  • Configuration summary. Local placement accuracy of 2 microns at 3 sigma.
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Narration transcript
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The text of the narrated walkthrough, step by step.

    
    
      
  1. Welcome to a demo of Predictika's Validator. An AI sales agent prepares a configuration for a high-accuracy die bonder: the die and wafer to be handled, the bond force, the placement accuracy and throughput the customer needs, and more. Before it goes out, the agent sends it to Predictika, which checks it against a declarative model of the published specification and options and returns a verdict, every reason and the figures it computed.
    2. 
      
  2. I will start with the first request by the agent.
    3. 
      
  3. The agent says. Please quote a Datacon 8800 CHAMEO advanced for face-down placement of 35 mm dies, 100 microns thick, from 12-inch wafers and strips up to 300 mm long. The quote states a local placement accuracy of 2 microns. The rest of the request is on screen.
    4. 
      
  4. Before it goes out, the agent calls the validator.
    5. 
      
  5. Blocked, with six findings, all in one answer. The die size is 35 mm; face-down placement takes 0.3 mm to 30 mm, or up to 40 mm with the 40 mm die option. The local placement accuracy needed is 2 microns at 3 sigma; the selected configuration gives 3 microns (3 microns standard, 2 microns with the high-accuracy option). The order feeds from tape but the tape feeder option is not selected. The other three are on screen.
    6. 
      
  6. The validator returned six blocking findings in one answer. A check that reads one field at a time would pass most of this; it shows only when the choices in the quote are checked against each other.
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  7. What this shows: for die size limits that depend on orientation and an option, a rules-based CPQ is error-prone for this.
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  8. Now the agent resubmits.
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  9. The corrected request. It changes the option: 40 mm die option to yes, the Option: Low-force option to yes, the Option: High-accuracy option to yes and the Option: Tape feeder to yes. Two more changes are on screen.
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  10. It calls the validator again.
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  11. This time the validator clears it.
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  12. All six earlier findings are cleared, and the validator's figure matches the quote.
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  13. Six problems caught in one call, fixed in one pass, and a clean quote. That is the value of Predictika's validator: catching mistakes before they reach the customer.
    14.