Predictika · Lam Research Kiyo and Flex etch quotes

An AI sales agent's etch tool quote, checked before it goes out

An AI sales agent drafts a quote for a Lam Research etch tool: Kiyo (conductor) or Flex (dielectric) chambers on the 2300 or Sense.i platform, with chillers, a spares kit and a service plan. Before it goes out, the agent sends it to Predictika, which checks the chamber, platform, power, node, export and service rules, compares the total and throughput the quote states with the computed ones, and returns every finding together with the line-item quote. This is an illustrative model built from Lam Research's public product information with fictional configuration limits and prices; it is not Lam Research's internal rule set.

Scope: Lam Research Kiyo (conductor) and Flex (dielectric) etch tools on the 2300 and Sense.i transfer platforms, with chillers, spares kit and service. See everything this validator covers

This validator models one product line: Lam Research Kiyo (conductor) and Flex (dielectric) etch chambers configured on the Lam 2300 or Sense.i transfer platform, with process chillers, a spares kit and a service plan. It handles any quote involving these products, not only the scenarios shown on this page.

Covered: chamber and platform fit — Kiyo for conductor and Flex for dielectric applications, which chambers are offered on which platform, the chamber count against the platform maximum, and one chiller per chamber.
Covered: facility power and throughput — the power the tool needs (platform, chambers and chillers together) against the customer's facility, and tool throughput (chambers times wafers per hour) against the requirement.
Covered: node qualification and export control — nodes below 7 nm needing an advanced chamber, advanced chambers blocked at export-restricted destinations, and trade-compliance review for any restricted destination.
Covered: service, delivery and the quote — Premium service needing four or more chambers and the full spares kit, a service term of 1 to 5 years, lead time against the need-by date, the agent's discount authority, the line-item quote, and the total and throughput the agent states.
Not covered — Lam's deposition, clean and other non-etch tool families; chambers sold apart from these two platforms; chamber-level process recipes; and real Lam prices, lead times or published configuration limits. Other areas can be added.
Labeled as assumptions — prices, power per chamber, wafers per hour, lead times, the chamber counts each platform allows, which chambers are offered on which platform, the 7 nm qualification line, the 5 percent and 12 percent discount limits and the service and spares percentages are invented illustrative values, not Lam data.

The AI sales agentBuilds the etch tool quote from the conversation and says it is ready.

Predictika validatorChecks every rule at once and returns the verdict, each finding, and the computed figures.

6 scenarios in 3 groups · each group runs from the agent’s first attempt to the outcome · click one to switch

What the agent proposes

The AI sales agent says

Illustrative agent statement. The validator receives the structured request below.

Proposing agent: AI sales agent (scripted)

Before sending, the agent must call Recorded run

Predictika validator

Waiting for the call.

What this means

Run the validator to see the outcome

The explanation appears here once the validator returns.

Where rules-based CPQ gets it wrong

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Our assessment of what a typical rules-based CPQ (product rules, price rules and validation rules, as in Salesforce CPQ) does with the same cases. It is a judgment about effort and reliability, not a claim that nothing can be built.

What the validator caught	Typical rules-based CPQ	Predictika
A chamber and platform change that moves the node, chamber count, chiller, facility power, spares and lead time limits	Only with workarounds Changing the chamber or the platform changes which nodes it qualifies for, how many chambers fit, how much power the tool draws, its lead time and which spares kit service needs. Each limit is its own rule that must read the new choice together with the rest, and one that is missed lets through a quote that no longer fits.	The platform, chamber, chillers, service and facility are read together on every call, so a change in one is checked against all the others.
A chamber on a platform that does not offer it, or too many chambers	Only with care A compatibility table per chamber and platform, kept by hand, and the maximum count is a separate validation rule on the quantity. A quote built from the wrong platform goes through.	Which chamber is offered on which platform, and the count limit, are part of the model; both are checked on every call.
Facility power summed across platform, chambers and chillers	Only with workarounds Price rules do not sum attributes across selected parts; the power check is usually done in code or by an engineer after the quote is sent.	Power is computed from the platform, chambers and chillers and compared with the facility figure on the same call.
Node qualification and export control keyed to chamber attributes	Only with care The rule has to be written per chamber SKU and per destination, so a new chamber needs new rules; any gap lets an advanced chamber ship to a restricted destination.	Advanced or not is an attribute of the chamber; the node and destination rules apply to every chamber, present or future.
Premium service prerequisites (four chambers and the full spares kit)	Only with care Dependency rules between the service tier, the chamber count and the spares choice, fragile when any of the three changes.	The prerequisites are checked together, and each failure comes back as its own finding.
A stated total or throughput that does not match the computed figure	Only with care A validation rule can compare a stated figure with a calculated field, but only if the stated figure is a field on the quote, which it rarely is.	The stated total and throughput travel with the quote and are compared with the computed ones on every call.

What this validator catches: findings from its test cases

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Every rule is checked on every call, in any order the choices arrive; one problem never hides another. Blocking findings stop the quote; approval findings need a person to sign off; everything else is computed.

1	5 chambers need 5 chillers; the quote has 3.
2	A 5 nm node needs an advanced chamber; Kiyo C series conductor etch is qualified for 7 nm and above.
3	A discount of 14 percent is above the 12 percent limit that no agent can exceed.
4	A discount of 8 percent is above the 5 percent an agent may give alone.
5	A service term of 6 years is outside the 1 to 5 years offered.
6	Advanced-node etch chambers cannot ship to an export-restricted destination.
7	Flex E series dielectric etch does not match a Conductor etch application; conductor etch needs a Kiyo chamber and dielectric etch needs a Flex chamber.
8	Flex H series high aspect ratio etch is not offered on the Lam 2300 transfer platform.
9	Lead time of 38 weeks exceeds the 30 weeks available.
10	Premium service requires a tool with at least 4 chambers.
11	Premium service requires the full on-site spares kit.
12	Stated throughput does not match: the agent stated 120 wafers per hour; the validator computes 108.
13	Stated total does not match: the agent stated $18,220,680.00; the validator computes $18,215,680.00.
14	The destination is export-restricted; trade-compliance license review is required.
15	The quote has 5 chambers, outside the 1 to 4 the Lam 2300 transfer platform supports.
16	The tool needs 458 kW but the facility provides 400 kW.
17	Tool throughput of 108 wafers per hour is below the 120 required.

Scenarios and results

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The recorded result of the validator for each scenario on this page: the request the AI agent sent, the verdict, and every finding, in the order they appear above.

1. Platform, node, power, service and delivery: Five Kiyo C on the 2300 for a 5 nm line

The agent's request. Please quote Hartwell Semiconductor a Lam 2300 transfer platform tool with five Kiyo C chambers and four chillers for a conductor etch application at 5 nm, shipping to the United States. The facility provides 250 kW, the customer needs 140 wafers per hour, and delivery is needed within 24 weeks. Include the basic spares kit and Premium service for 3 years, with a 5 percent discount. The quote states a total of $23,400,970.00 and a tool throughput of 150 wafers per hour. It is ready to send.

Verdict: Blocked.

Chamber count outside the platform limit. The quote has 5 chambers, outside the 1 to 4 the Lam 2300 transfer platform supports.
Chiller count does not match chambers. 5 chambers need 5 chillers; the quote has 4.
Facility power too low. The tool needs 292 kW but the facility provides 250 kW.
Node needs an advanced chamber. A 5 nm node needs an advanced chamber; Kiyo C series conductor etch is qualified for 7 nm and above.
Premium service needs the full spares kit. Premium service requires the full on-site spares kit.
Lead time too long. Lead time of 26 weeks exceeds the 24 weeks available.

2. Platform, node, power, service and delivery: Moved to Kiyo F on the Sense.i

The agent's request. Please quote Hartwell Semiconductor a Sense.i platform tool with five Kiyo F chambers and five chillers for a conductor etch application at 5 nm, shipping to the United States. The facility provides 250 kW, the customer needs 140 wafers per hour, and delivery is needed within 24 weeks. Include the full spares kit and Premium service for 3 years, with a 5 percent discount. The quote states a total of $30,540,600.00 and a tool throughput of 140 wafers per hour. It is ready to send.

Verdict: Blocked.

Facility power too low. The tool needs 315 kW but the facility provides 250 kW.
Lead time too long. Lead time of 34 weeks exceeds the 24 weeks available.

3. Platform, node, power, service and delivery: More facility power, 34 weeks

The agent's request. Please quote Hartwell Semiconductor a Sense.i platform tool with five Kiyo F chambers and five chillers for a conductor etch application at 5 nm, shipping to the United States. The facility provides 320 kW, the customer needs 140 wafers per hour, and delivery is needed within 34 weeks. Include the full spares kit and Premium service for 3 years, with a 5 percent discount. The quote states a total of $30,540,600.00 and a tool throughput of 140 wafers per hour. It is ready to send.

Verdict: Allowed.

Quote summary. Total $30,540,600.00: platform $3,200,000.00; chambers $19,000,000.00; chillers $600,000.00; spares $1,824,000.00; service $7,524,000.00; discount -$1,607,400.00.

4. Node qualification and service: Kiyo C at 5 nm on Premium

The agent's request. Please quote Corvane Devices a Sense.i platform tool with four Kiyo C chambers and four chillers for a conductor etch application at 5 nm, shipping to the United States. The facility provides 300 kW, the customer needs 100 wafers per hour, and delivery is needed within 36 weeks. Include the basic spares kit and Premium service for 3 years, with a 3 percent discount. The quote states a total of $20,837,152.00 and a tool throughput of 120 wafers per hour. It is ready to send.

Verdict: Blocked.

Node needs an advanced chamber. A 5 nm node needs an advanced chamber; Kiyo C series conductor etch is qualified for 7 nm and above.
Premium service needs the full spares kit. Premium service requires the full on-site spares kit.

5. Node qualification and service: Kiyo F, full spares, 8 percent

The agent's request. Please quote Corvane Devices a Sense.i platform tool with four Kiyo F chambers and four chillers for a conductor etch application at 5 nm, shipping to the United States. The facility provides 300 kW, the customer needs 100 wafers per hour, and delivery is needed within 36 weeks. Include the full spares kit and Premium service for 3 years, with an 8 percent discount. The quote states a total of $24,491,136.00 and a tool throughput of 112 wafers per hour. It is ready to send.

Verdict: Needs approval.

Discount above the agent limit. A discount of 8 percent is above the 5 percent an agent may give alone.
Quote summary. Total $24,491,136.00: platform $3,200,000.00; chambers $15,200,000.00; chillers $480,000.00; spares $1,510,400.00; service $6,230,400.00; discount -$2,129,664.00.

6. Export, lead time and discount: Restricted destination, 14 percent

The agent's request. Please quote Orlin Components a Sense.i platform tool with four Flex H chambers and four chillers for a dielectric etch application at 5 nm, shipping to an export-restricted destination. The facility provides 400 kW, the customer needs 70 wafers per hour, and delivery is needed within 30 weeks. Include the basic spares kit and Advanced service for 3 years, with a 14 percent discount. The quote states a total of $23,865,344.00 and a tool throughput of 72 wafers per hour. It is ready to send.

Verdict: Blocked.

Advanced chamber to a restricted destination. Advanced-node etch chambers cannot ship to an export-restricted destination.
Lead time too long. Lead time of 38 weeks exceeds the 30 weeks available.
Discount above the hard limit. A discount of 14 percent is above the 12 percent limit that no agent can exceed.
Export review needed. The destination is export-restricted; trade-compliance license review is required.

Narration transcript

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The text of the narrated walkthrough, step by step.

Welcome to a demo of Predictika's Validator. An AI sales agent drafts a quote for a Lam Research etch tool: Kiyo (conductor) or Flex (dielectric) chambers on the 2300 or Sense.i platform. Before it goes out, the agent sends it to Predictika, which checks the chamber, platform, power, node, export and service rules, compares the total and throughput the quote states with the computed ones, and returns every finding together with the line-item quote. This is an illustrative model built from Lam Research's public product information with fictional configuration limits and prices; it is not Lam Research's internal rule set.
I will start with the first request by the agent.
The agent says. Please quote Hartwell Semiconductor a Lam 2300 transfer platform tool. The facility provides 250 kW, the customer needs 140 wafers per hour, and delivery is needed within 24 weeks. The rest of the request is on screen. The quote states a total of $23,400,970.00 and a tool throughput of 150 wafers per hour.
Before it goes out, the agent calls the validator.
Blocked, with six findings, all in one answer. The quote has 5 chambers, outside the 1 to 4 the Lam 2300 transfer platform supports. 5 chambers need 5 chillers; the quote has 4. The tool needs 292 kW but the facility provides 250 kW. The other three are on screen.
The validator returned six blocking findings in one answer. A check that reads one field at a time would pass most of this; it shows only when the choices in the quote are checked against each other.
What this shows: for a chamber and platform change that moves the node, chamber count, chiller, facility power, spares and lead time limits, a rules-based CPQ can do this only with workarounds.
Now the agent resubmits.
The corrected request. It changes the platform to sense.i platform, the chamber to Kiyo F series conductor etch, the chillers to 5, the spares kit to full, the stated total to $30,540,600 and the stated throughput to 140 wafers per hour.
It calls the validator again.
Still blocked, with two findings, all in one answer. The tool needs 315 kW but the facility provides 250 kW. Lead time of 34 weeks exceeds the 24 weeks available.
Four findings cleared; still blocked on facility power too low and lead time too long.
The agent resubmits once more.
The revised request. It changes the facility power to 320 kW and the need-by to 34 weeks.
It calls the validator once more.
This time the validator clears it.
The validator also returns the line-item quote. It starts with Sense.i platform and Kiyo F series conductor etch; the other four lines are on screen.
Both earlier findings are cleared, and the validator's total, $30,540,600.00, matches the quote.
Six problems caught in one call, fixed in two passes, and a clean $30,540,600 quote. That is the value of Predictika's validator: catching mistakes before they reach the customer.