Predictika · Semiconductor advanced packaging

An AI sales agent's scanner order, checked before it goes out

An AI sales agent prepares an order for a SUSS MicroTec DSC300 Gen3 scanner for an advanced-packaging line: wafer and mask size, alignment type and the options that go with it, the overlay, warpage and wafer thickness the process needs, throughput, and the room the tool will stand in. Before it goes out, the agent sends it to Predictika, which checks it against a declarative model of what the DSC300 Gen3 technical data sheet says and returns a verdict, every reason and the weight it computed. The customer is fictional.

Scope: SUSS MicroTec DSC300 Gen3 scanner only: wafer and mask sizes, alignment options, overlay, warpage, thin substrates, die-shift correction, optics, throughput, footprint, height and weight. See everything this validator covers

This validator models orders of one tool, the SUSS DSC300 Gen3 scanner, based on its public technical data sheet (2021) and the SUSS product overview brochure, not just the scenarios shown below.

  • Wafers and masks — 300 mm wafers with 14 inch masks as standard; 200 mm and 330 mm wafers need the wafer-size option, and the 9 inch mask (for 200 mm wafers) is optional. The data sheet states no mask size for 330 mm wafers, so that goes to a person.
  • Alignment and overlay — optical alignment gives 1000 nm overlay (mean plus 3 sigma); infrared top-side alignment and back-side alignment give 2500 nm. Infrared top-side alignment is an option, and back-side alignment needs the optional IR TSA module.
  • Warpage, thin substrates and die shift — warpage under 2 mm is standard and up to 5 mm is customized (a person confirms it); substrates thinner than 200 micrometers need a carrier; die-shift correction needs the optional magnification correction and beam steering, up to 200 ppm.
  • Optics and process — the listed numerical apertures, an exposure wavelength from 350 to 450 nm, 2 micrometer lines and spaces, and optional pellicle mask handling.
  • Throughput, site and weight — the data sheet throughput for 300 mm wafers (more than 90 an hour up to 400 mJ per square centimeter, more than 80 an hour up to 1000 mJ), the footprint with peripherals, the height, and the combined weight of the tool, front-end module and environmental control unit against the floor rating and the weight the order states.

Any order of DSC300 Gen3 scanners that touches these rules is in scope — not only the scenarios pictured here. Not covered: other SUSS systems (including the MA/BA Gen4 aligners), prices (SUSS does not publish them), delivery, service contracts, facility utilities, and process results beyond the data sheet.

The AI sales agentBuilds the scanner order from the conversation and says it is ready.
Predictika validatorChecks every rule at once and returns the verdict, each finding, and the computed figures.

7 scenarios in 3 groups · each group runs from the agent’s first attempt to the outcome · click one to switch

What the agent proposes

The AI sales agent says

Illustrative agent statement. The validator receives the structured request below.

Proposing agent: AI sales agent (scripted)

Before sending, the agent must call Recorded run

Predictika validator


      

        
        
        
      

      
Waiting for the call.

      
    

  

  
  

    
Where rules-based CPQ gets it wrong
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Our assessment of what a typical rules-based CPQ (product rules, price rules and validation rules, as in Salesforce CPQ) does with the same cases. It is a judgment about effort and reliability, not a claim that nothing can be built.

    
What the validator caughtTypical rules-based CPQPredictika
An option that a requirement depends onOnly with workarounds
Back-side alignment, die-shift correction and pellicle handling are each available only with an optional module. A rules-based CPQ needs a rule per requirement and option pair, and the requirement is usually not captured as a field at all.		The requirement and the option arrive in one request and are compared on every call.
Limits that change with other choicesOnly with care
The overlay a line can count on is 1000 nm with optical alignment but 2500 nm with infrared or back-side alignment, and throughput depends on dose and wafer size. A rule can encode each case, but they must be kept in step.		The alignment, dose and wafer size are read together and the limit that applies is computed on every call.
Weight the order statesOnly with care
The stated weight is a free-entry field; a rule has to add up the three weights and compare.		The stated weight is a field in the request, compared with the computed sum on every call.
Every problem returned in one answerOnly with workarounds
Rules tend to fire as the quote is saved or a step is completed, so a person often fixes one error and meets the next.		All findings come back together, whatever order the choices arrived in.

  

  

    
What this validator catches: findings from its test cases
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Every rule is checked on every call, in any order the choices arrive; one problem never hides another. Blocking findings stop the quote; approval findings need a person to sign off; everything else is computed.

    
1The data sheet gives throughput only for 300 mm wafers at doses up to 1000 mJ per square centimeter; a person should confirm the throughput.
2The data sheet does not state a mask size for 330 mm wafers; a person should confirm it.
3The data sheet lists wafers of 300 mm, with 200 mm and 330 mm optional; 250 mm is not listed.
4200 mm and 330 mm wafers are optional on the data sheet; the order does not include the wafer-size option.
5The data sheet pairs 14 inch masks with 300 mm wafers and 9 inch masks with 200 mm wafers; the order has a 14 inch mask.
6The data sheet pairs 14 inch masks with 300 mm wafers and 9 inch masks with 200 mm wafers; the order has a 9 inch mask.
7The 9 inch mask size is optional on the data sheet; the order does not include it.
8The data sheet lists 14 inch masks, with 9 inch optional; 12 inch is not listed.
9The data sheet pairs 14 inch masks with 300 mm wafers and 9 inch masks with 200 mm wafers; the order has a 12 inch mask.
10Back-side alignment is available only with the optional IR TSA module; the order does not include it.
11Infrared top-side alignment is optional on the data sheet; the order does not include it.
12The order needs an overlay of 999 nm; the data sheet gives 1000 nm (mean plus 3 sigma) for the selected alignment.
13The order needs an overlay of 2400 nm; the data sheet gives 2500 nm (mean plus 3 sigma) for the selected alignment.
14The order needs an overlay of 1500 nm; the data sheet gives 2500 nm (mean plus 3 sigma) for the selected alignment.
15The standard warpage allowance is below 2 mm and up to 5 mm is customized; a person should confirm the customization.
16The order has 5001 micrometers of wafer warpage; the data sheet allows up to 5 mm.
17Substrates thinner than 200 micrometers cannot run without a carrier; the order has 199 micrometers and no carrier.
18The order needs 201 ppm of symmetric correction; the data sheet gives up to 200 ppm.
19Magnification correction and beam steering for die shift is optional on the data sheet; the order does not include it.
20The selectable numerical apertures are 0.15, 0.14, 0.10 and 0.07; the order asks for 12 hundredths.
21The exposure wavelength is selectable from 350 to 450 nm; the order asks for 349 nm.
22The exposure wavelength is selectable from 350 to 450 nm; the order asks for 451 nm.
23The order needs 1 micrometer lines and spaces; the data sheet gives 2 micrometers.
24Pellicle mask handling is optional on the data sheet; the order does not include it.

  

  

    
Scenarios and results
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The recorded result of the validator for each scenario on this page: the request the AI agent sent, the verdict, and every finding, in the order they appear above.

    
1. Die-shift correction: A fan-out line needing 150 ppm of die-shift correction at 85 wafers an hour, without the correction option

    
The agent's request. Please quote a DSC300 Gen3 scanner for 300 mm wafers with 14 inch masks, optical alignment, an overlay of 1,500 nm, warpage of 1,000 micrometers and wafers 775 micrometers thick, with no carrier. The process needs 150 ppm of die-shift correction, a numerical aperture of 0.15, an exposure wavelength of 365 nm, 3 micrometer lines and spaces, a dose of 400 mJ per square centimeter and 85 wafers an hour. Ordered options: wafer-size option not ordered, 9 inch mask not ordered, infrared top-side alignment not ordered, IR TSA module not ordered, magnification correction not ordered, pellicle handling not ordered; pellicle masks are not needed. The room is 4,500 mm by 5,200 mm and 3,000 mm high with a floor rated for 7,000 kg, and the quote states a total weight of 5,439 kg. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Die-shift correction needs its option. Magnification correction and beam steering for die shift is optional on the data sheet; the order does not include it.
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2. Die-shift correction: The agent resubmits after fixing the errors

    
The agent's request. Please quote a DSC300 Gen3 scanner for 300 mm wafers with 14 inch masks, optical alignment, an overlay of 1,500 nm, warpage of 1,000 micrometers and wafers 775 micrometers thick, with no carrier. The process needs 150 ppm of die-shift correction, a numerical aperture of 0.15, an exposure wavelength of 365 nm, 3 micrometer lines and spaces, a dose of 400 mJ per square centimeter and 85 wafers an hour. Ordered options: wafer-size option not ordered, 9 inch mask not ordered, infrared top-side alignment not ordered, IR TSA module not ordered, magnification correction ordered, pellicle handling not ordered; pellicle masks are not needed. The room is 4,500 mm by 5,200 mm and 3,000 mm high with a floor rated for 7,000 kg, and the quote states a total weight of 5,439 kg. It is ready to send.

    
Verdict: Allowed.

    
    
      
  • Order summary. The tool, its front-end module and its environmental control unit weigh 5439 kg together; the footprint with peripherals is 3220 mm by 4197 mm and 2466 mm high.
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3. Thinned wafers and back-side alignment: Thinned 150 micrometer wafers with back-side alignment and a 3000 nm overlay, with neither a carrier nor the IR TSA module

    
The agent's request. Please quote a DSC300 Gen3 scanner for 300 mm wafers with 14 inch masks, optical alignment with back-side alignment, an overlay of 3,000 nm, warpage of 1,000 micrometers and wafers 150 micrometers thick, with no carrier. The process needs 120 ppm of die-shift correction, a numerical aperture of 0.15, an exposure wavelength of 365 nm, 3 micrometer lines and spaces, a dose of 800 mJ per square centimeter and 70 wafers an hour. Ordered options: wafer-size option not ordered, 9 inch mask not ordered, infrared top-side alignment not ordered, IR TSA module not ordered, magnification correction ordered, pellicle handling not ordered; pellicle masks are not needed. The room is 4,500 mm by 5,200 mm and 3,000 mm high with a floor rated for 7,000 kg, and the quote states a total weight of 5,439 kg. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Back-side alignment needs the IR TSA option. Back-side alignment is available only with the optional IR TSA module; the order does not include it.
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  • Thin substrate needs a carrier. Substrates thinner than 200 micrometers cannot run without a carrier; the order has 150 micrometers and no carrier.
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4. Thinned wafers and back-side alignment: The agent resubmits after fixing the errors

    
The agent's request. Please quote a DSC300 Gen3 scanner for 300 mm wafers with 14 inch masks, optical alignment with back-side alignment, an overlay of 3,000 nm, warpage of 1,000 micrometers and wafers 150 micrometers thick, run on a carrier. The process needs 120 ppm of die-shift correction, a numerical aperture of 0.15, an exposure wavelength of 365 nm, 3 micrometer lines and spaces, a dose of 800 mJ per square centimeter and 70 wafers an hour. Ordered options: wafer-size option not ordered, 9 inch mask not ordered, infrared top-side alignment not ordered, IR TSA module not ordered, magnification correction ordered, pellicle handling not ordered; pellicle masks are not needed. The room is 4,500 mm by 5,200 mm and 3,000 mm high with a floor rated for 7,000 kg, and the quote states a total weight of 5,439 kg. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Back-side alignment needs the IR TSA option. Back-side alignment is available only with the optional IR TSA module; the order does not include it.
    • 
    

    
5. Thinned wafers and back-side alignment: The agent resubmits after fixing the errors

    
The agent's request. Please quote a DSC300 Gen3 scanner for 300 mm wafers with 14 inch masks, optical alignment with back-side alignment, an overlay of 3,000 nm, warpage of 1,000 micrometers and wafers 150 micrometers thick, run on a carrier. The process needs 120 ppm of die-shift correction, a numerical aperture of 0.15, an exposure wavelength of 365 nm, 3 micrometer lines and spaces, a dose of 800 mJ per square centimeter and 70 wafers an hour. Ordered options: wafer-size option not ordered, 9 inch mask not ordered, infrared top-side alignment not ordered, IR TSA module ordered, magnification correction ordered, pellicle handling not ordered; pellicle masks are not needed. The room is 4,500 mm by 5,200 mm and 3,000 mm high with a floor rated for 7,000 kg, and the quote states a total weight of 5,439 kg. It is ready to send.

    
Verdict: Allowed.

    
    
      
  • Order summary. The tool, its front-end module and its environmental control unit weigh 5439 kg together; the footprint with peripherals is 3220 mm by 4197 mm and 2466 mm high.
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6. Pellicle masks: A pellicle-mask line without the pellicle handling option

    
The agent's request. Please quote a DSC300 Gen3 scanner for 300 mm wafers with 14 inch masks, optical alignment, an overlay of 1,200 nm, warpage of 1,000 micrometers and wafers 775 micrometers thick, with no carrier. The process needs 0 ppm of die-shift correction, a numerical aperture of 0.15, an exposure wavelength of 365 nm, 3 micrometer lines and spaces, a dose of 400 mJ per square centimeter and 88 wafers an hour. Ordered options: wafer-size option not ordered, 9 inch mask not ordered, infrared top-side alignment not ordered, IR TSA module not ordered, magnification correction not ordered, pellicle handling not ordered; pellicle masks are needed. The room is 4,200 mm by 3,600 mm and 3,000 mm high with a floor rated for 6,000 kg, and the quote states a total weight of 5,439 kg. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Pellicle handling needs its option. Pellicle mask handling is optional on the data sheet; the order does not include it.
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7. Pellicle masks: The agent resubmits after fixing the errors

    
The agent's request. Please quote a DSC300 Gen3 scanner for 300 mm wafers with 14 inch masks, optical alignment, an overlay of 1,200 nm, warpage of 1,000 micrometers and wafers 775 micrometers thick, with no carrier. The process needs 0 ppm of die-shift correction, a numerical aperture of 0.15, an exposure wavelength of 365 nm, 3 micrometer lines and spaces, a dose of 400 mJ per square centimeter and 88 wafers an hour. Ordered options: wafer-size option not ordered, 9 inch mask not ordered, infrared top-side alignment not ordered, IR TSA module not ordered, magnification correction not ordered, pellicle handling ordered; pellicle masks are needed. The room is 4,200 mm by 3,600 mm and 3,000 mm high with a floor rated for 6,000 kg, and the quote states a total weight of 5,439 kg. It is ready to send.

    
Verdict: Allowed.

    
    
      
  • Order summary. The tool, its front-end module and its environmental control unit weigh 5439 kg together; the footprint with peripherals is 3220 mm by 4197 mm and 2466 mm high.
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Narration transcript
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The text of the narrated walkthrough, step by step.

    
    
      
  1. Welcome to a demo of Predictika's Validator. An AI sales agent prepares an order for a SUSS MicroTec DSC300 Gen3 scanner for an advanced-packaging line: wafer and mask size, alignment type and the options that go with it, the overlay, and more. Before it goes out, the agent sends it to Predictika, which checks it against a declarative model of what the DSC300 Gen3 technical data sheet says and returns a verdict, every reason and the weight it computed. The customer is fictional.
    2. 
      
  2. I will start with the first request by the agent.
    3. 
      
  3. The agent says. Please quote a DSC300 Gen3 scanner for 300 mm wafers with 14 inch masks, optical alignment with back-side alignment, an overlay of 3,000 nm. The process needs 120 ppm of die-shift correction, a numerical aperture of 0.15, an exposure wavelength of 365 nm, 3 micrometer lines and spaces. The rest of the request is on screen. The room is 4,500 mm by 5,200 mm and 3,000 mm high with a floor rated for 7,000 kg, and the quote states a total weight of 5,439 kg.
    4. 
      
  4. Before it goes out, the agent calls the validator.
    5. 
      
  5. Blocked, with two findings, all in one answer. Back-side alignment is available only with the optional IR TSA module; the order does not include it. Substrates thinner than 200 micrometers cannot run without a carrier; the order has 150 micrometers and no carrier.
    6. 
      
  6. The validator returned two blocking findings in one answer. A check that reads one field at a time would pass most of this; it shows only when the choices in the quote are checked against each other.
    7. 
      
  7. What this shows: for an option that a requirement depends on, a rules-based CPQ can do this only with workarounds.
    8. 
      
  8. Now the agent resubmits.
    9. 
      
  9. The corrected request. It changes the carrier used to yes.
    10. 
      
  10. It calls the validator again.
    11. 
      
  11. Still blocked, with one finding, all in one answer. Back-side alignment is available only with the optional IR TSA module; the order does not include it.
    12. 
      
  12. One finding cleared. Still blocking: back-side alignment needs the IR TSA option.
    13. 
      
  13. The agent resubmits once more.
    14. 
      
  14. The revised request. It changes the IR TSA module ordered to yes.
    15. 
      
  15. It calls the validator once more.
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  16. This time the validator clears it.
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  17. The earlier finding is cleared, and the validator's figure matches the quote.
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  18. Two problems caught in one call, fixed in two passes, and a clean quote. That is the value of Predictika's validator: catching mistakes before they reach the customer. Now you can try the other scenarios yourself.
    19.