Predictika · Wafer bonding platform configurations

An AI sales agent's wafer bonding platform configuration, checked before it goes out

An AI sales agent prepares a configuration for an automated wafer bonding platform: wafer size, load ports, the process modules and their options, the bond force and temperature the process needs, and the number of process modules the quote states. Before it goes out, the agent sends it to Predictika, which checks it against a declarative model of the limits in the published brochure and returns a verdict, every reason and the figures it computed.

Scope: XBS300 hybrid bonding platform configurations: wafer size, load ports, bond aligner, process modules and their options, bond force and temperature limits. See everything this validator covers

This validator models XBS300 platform configurations, not just the scenarios shown below.

  • Platform limits — 200 mm and 300 mm wafers, up to four load ports, one bond aligner and up to six process modules; the process module count the quote states must equal the configuration.
  • Process modules — low force bond chamber, plasma chamber, aqueous cleaner, detach station and metrology module; a bond force request (up to 15 kN) or bond temperature request (up to 250 °C) needs a bond chamber.
  • Module options — the cool plate and process gas MFC belong to the bond chamber; backside rinse, N2 spin-dry and SC1 compatibility to the aqueous cleaner; wafer rework to the detach station; IR overlay, IR void detection, TTV measurement and closed-loop feedback to the metrology module.
  • On request — reflective IR alignment and special wafer handlers are offered on request, so a request for either goes to a person.

Any XBS300 configuration that touches these rules is in scope — not only the scenarios pictured here. Not covered: prices (SUSS MicroTec publishes none, so this validator produces no price build-up or line-item quote), other SUSS platforms (including the XBC300 Gen2 D2W/W2W), the Media Cabinet III Ex, factory automation, service and delivery. Assumptions: the minimum of one load port, the counting of the detach station among the six process modules and the 15 kN limit applying at both wafer sizes are this model's reading of the brochure.

The AI sales agentBuilds the platform configuration from the customer's process requirements and says it is ready.
Predictika validatorChecks every rule at once and returns the verdict, each finding, and the computed figures.

7 scenarios in 3 groups · each group runs from the agent’s first attempt to the outcome · click one to switch

What the agent proposes

The AI sales agent says

Illustrative agent statement. The validator receives the structured request below.

Proposing agent: AI sales agent (scripted)

Before sending, the agent must call Recorded run

Predictika validator


      

        
        
        
      

      
Waiting for the call.

      
    

  

  
  

    
Where rules-based CPQ gets it wrong
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Our assessment of what a typical rules-based CPQ (product rules, price rules and validation rules, as in Salesforce CPQ) does with the same cases. It is a judgment about effort and reliability, not a claim that nothing can be built.

    
What the validator caughtTypical rules-based CPQPredictika
Options that only exist inside a particular moduleOnly with care
Each option depends on a module being present (cool plate on the bond chamber, rework on the detach station, IR options on metrology); a product rule per option works, but each is another rule to maintain.		Every option is checked against the modules actually in the configuration, together with everything else on every call.
A limit shared across several module typesOnly with workarounds
The six-module limit counts five different module types together; a CPQ needs a roll-up field and a validation rule that reads it.		The module total is computed from the quantities of every module type and compared with the limit.
A process requirement that depends on a module being presentOnly with care
A requested bond force or temperature is meaningless without a bond chamber and has its own limits; this takes separate rules for presence and range.		The requirement is checked for presence of the bond chamber and against the chamber's force and temperature limits.
A module count the quote states that must match the configurationOnly with workarounds
The stated figure is typed text on the quote; a CPQ computes the real count but rarely compares it with what was written.		The stated module count is compared with the computed count on every call.
Every problem returned in one answerOnly with workarounds
Rules tend to fire as a step is saved, so a rep often fixes one error and meets the next.		All findings come back together, whatever order the choices arrived in.

  

  

    
What this validator catches: findings from its test cases
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Every rule is checked on every call, in any order the choices arrive; one problem never hides another. Blocking findings stop the quote; approval findings need a person to sign off; everything else is computed.

    
1The XBS300 handles 200 mm and 300 mm wafers; the quote has 150 mm wafers.
2The platform takes up to four load ports (at least one is needed); the quote has 5.
3The platform takes up to four load ports (at least one is needed); the quote has 0.
4The platform has one bond aligner; the quote has 2.
5The platform has one bond aligner; the quote has 0.
6The platform takes up to six process modules; the quote has 7.
7The quote states 5 process modules but the configuration has 4.
8A bond force or bond temperature is requested but the quote has no low force bond chamber.
9The low force bond chamber produces up to 15 kN; the quote asks for 20 kN.
10The bond chamber reaches up to 250 degrees C; the quote asks for 300 degrees C.
11The cool plate is installed in the low force bond chamber and the quote has none.
12The optional process gas MFC is a bond chamber option and the quote has no bond chamber.
13Backside rinse, N2 spin-dry and SC1 compatibility are aqueous cleaner options and the quote has no aqueous cleaner.
14The wafer rework option belongs to the detach station and the quote has none.
15IR overlay measurement, IR void detection and TTV measurement are metrology module options and the quote has no metrology module.
16Closed-loop feedback to the bond aligner comes from the metrology module and the quote has none.
17Reflective IR alignment is available on request; a person should confirm it with the supplier.
18Special wafer handlers (for example for warped wafers) are available on request; a person should confirm them with the supplier.
19The quote states 6 process modules but the configuration has 4.

  

  

    
Scenarios and results
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The recorded result of the validator for each scenario on this page: the request the AI agent sent, the verdict, and every finding, in the order they appear above.

    
1. Production platform: A production platform with two metrology modules

    
The agent's request. Please quote an XBS300 hybrid bonding platform for 300 mm wafers with 4 load ports, one bond aligner with the optional overlay accuracy below 100 nm and these process modules: 2 low force bond chambers, 1 plasma chamber, 1 aqueous cleaner, 1 detach station and 2 metrology modules. Options: a cool plate. The process needs a bond force of 12 kN and a bond temperature of 220 degrees C. The quote lists 6 process modules in total. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Too many process modules. The platform takes up to six process modules; the quote has 7.
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  • Stated module count differs. The quote states 6 process modules but the configuration has 7.
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2. Production platform: The agent resubmits after fixing the errors

    
The agent's request. Please quote an XBS300 hybrid bonding platform for 300 mm wafers with 4 load ports, one bond aligner with the optional overlay accuracy below 100 nm and these process modules: 2 low force bond chambers, 1 plasma chamber, 1 aqueous cleaner, 1 detach station and 1 metrology module. Options: a cool plate. The process needs a bond force of 12 kN and a bond temperature of 220 degrees C. The quote lists 6 process modules in total. It is ready to send.

    
Verdict: Allowed.

    
    
      
  • Configuration summary. 300 mm wafers, 4 load port(s), 6 process module(s), overlay accuracy below 100 nm (optional setup).
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3. R&D platform: An R&D platform asking for void detection and closed-loop feedback

    
The agent's request. Please quote an XBS300 hybrid bonding platform for 200 mm wafers with 2 load ports, one bond aligner and these process modules: 1 low force bond chamber, 1 plasma chamber and 1 aqueous cleaner. Options: IR void detection and closed-loop feedback. The process needs a bond force of 12 kN and a bond temperature of 280 degrees C. The quote lists 3 process modules in total. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Bond temperature above the chamber limit. The bond chamber reaches up to 250 degrees C; the quote asks for 280 degrees C.
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  • Metrology options need a metrology module. IR overlay measurement, IR void detection and TTV measurement are metrology module options and the quote has no metrology module.
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  • Closed-loop feedback needs metrology. Closed-loop feedback to the bond aligner comes from the metrology module and the quote has none.
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4. R&D platform: The agent resubmits after fixing the errors

    
The agent's request. Please quote an XBS300 hybrid bonding platform for 200 mm wafers with 2 load ports, one bond aligner and these process modules: 1 low force bond chamber, 1 plasma chamber, 1 aqueous cleaner and 1 metrology module. Options: IR void detection and closed-loop feedback. The process needs a bond force of 12 kN and a bond temperature of 250 degrees C. The quote lists 4 process modules in total. It is ready to send.

    
Verdict: Allowed.

    
    
      
  • Configuration summary. 200 mm wafers, 2 load port(s), 4 process module(s), overlay accuracy below 400 nm (default setup).
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5. Options before their modules: A configuration with options but no modules to carry them

    
The agent's request. Please quote an XBS300 hybrid bonding platform for 300 mm wafers with 3 load ports, one bond aligner and these process modules: 1 plasma chamber and 1 metrology module. Options: a cool plate, backside rinse, wafer rework and reflective IR alignment. The process needs a bond force of 8 kN. The quote lists 2 process modules in total. It is ready to send.

    
Verdict: Blocked.

    
    
      
  • Bond process needs a bond chamber. A bond force or bond temperature is requested but the quote has no low force bond chamber.
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  • Cool plate needs a bond chamber. The cool plate is installed in the low force bond chamber and the quote has none.
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  • Cleaner options need an aqueous cleaner. Backside rinse, N2 spin-dry and SC1 compatibility are aqueous cleaner options and the quote has no aqueous cleaner.
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  • Wafer rework needs a detach station. The wafer rework option belongs to the detach station and the quote has none.
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  • Reflective infrared alignment is on request. Reflective IR alignment is available on request; a person should confirm it with the supplier.
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6. Options before their modules: The agent resubmits after fixing the errors

    
The agent's request. Please quote an XBS300 hybrid bonding platform for 300 mm wafers with 3 load ports, one bond aligner and these process modules: 1 low force bond chamber, 1 plasma chamber, 1 aqueous cleaner, 1 detach station and 1 metrology module. Options: a cool plate, backside rinse, wafer rework and reflective IR alignment. The process needs a bond force of 8 kN. The quote lists 5 process modules in total. It is ready to send.

    
Verdict: Needs approval.

    
    
      
  • Reflective infrared alignment is on request. Reflective IR alignment is available on request; a person should confirm it with the supplier.
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  • Configuration summary. 300 mm wafers, 3 load port(s), 5 process module(s), overlay accuracy below 400 nm (default setup).
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7. Options before their modules: The agent resubmits after fixing the errors

    
The agent's request. Please quote an XBS300 hybrid bonding platform for 300 mm wafers with 3 load ports, one bond aligner and these process modules: 1 low force bond chamber, 1 plasma chamber, 1 aqueous cleaner, 1 detach station and 1 metrology module. Options: a cool plate, backside rinse and wafer rework. The process needs a bond force of 8 kN. The quote lists 5 process modules in total. It is ready to send.

    
Verdict: Allowed.

    
    
      
  • Configuration summary. 300 mm wafers, 3 load port(s), 5 process module(s), overlay accuracy below 400 nm (default setup).
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Narration transcript
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The text of the narrated walkthrough, step by step.

    
    
      
  1. Welcome to a demo of Predictika's Validator. An AI sales agent prepares a configuration for an automated wafer bonding platform: wafer size, load ports, the process modules and their options, and more. Before it goes out, the agent sends it to Predictika, which checks it against a declarative model of the limits in the published brochure and returns a verdict, every reason and the figures it computed.
    2. 
      
  2. I will start with the first request by the agent.
    3. 
      
  3. The agent says. Please quote an XBS300 hybrid bonding platform for 300 mm wafers with 3 load ports, one bond aligner and these process modules: 1 plasma chamber and 1 metrology module. Options: a cool plate, backside rinse, wafer rework and reflective IR alignment. The rest of the request is on screen.
    4. 
      
  4. Before it goes out, the agent calls the validator.
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  5. Blocked, with four findings and one approval, all in one answer. A bond force or bond temperature is requested but the quote has no low force bond chamber. The cool plate is installed in the low force bond chamber and the quote has none. Backside rinse, N2 spin-dry and SC1 compatibility are aqueous cleaner options and the quote has no aqueous cleaner. The other one is on screen.
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  6. The validator returned four blocking findings and one approval in one answer. A check that reads one field at a time would pass most of this; it shows only when the choices in the quote are checked against each other.
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  7. What this shows: for options that only exist inside a particular module, a rules-based CPQ is error-prone for this.
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  8. Now the agent resubmits.
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  9. The corrected request. It changes the low force bond chambers to 1, the aqueous cleaners to 1, the detach stations to 1 and the stated process modules to 5.
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  10. It calls the validator again.
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  11. Not blocked, but held for a person.
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  12. The four blocking findings are cleared; one approval remains for a person: reflective infrared alignment is on request.
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  13. The agent resubmits once more.
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  14. The revised request. It removes the Reflective IR alignment.
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  15. It calls the validator once more.
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  16. This time the validator clears it.
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  17. The earlier finding is cleared, and the validator's figure matches the quote.
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  18. Five problems caught in one call, fixed in two passes, and a clean quote. That is the value of Predictika's validator: catching mistakes before they reach the customer. Now you can try the other scenarios yourself.
    19.